Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More
See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.