Ansys 2023 R2: Ansys Thermal Integrity What’s New

Ansys 2023 R2: Ansys Thermal Integrity What’s New
by Admin on 06-13-2023 at 5:14 pm

See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.

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Ansys 2023 R1: Ansys Icepak with AEDT What’s New

Ansys 2023 R1: Ansys Icepak with AEDT What’s New
by Admin on 02-06-2023 at 2:20 pm

The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal.

TIME:
MARCH 22, 2023
11 AM EDT / 3 PM GMT / 8:30 PM IST

Venue:
Virtual

About this Webinar

The 2023 R1 release for Ansys Icepak offers

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Webinar: Dynamic Thermal Management Using AEDT Icepak

Webinar: Dynamic Thermal Management Using AEDT Icepak
by Admin on 02-06-2023 at 2:08 pm

The ever-increasing need for faster, smaller, and multi-tasking electronic devices poses a significant thermal management challenge for the processor and the system. Manufacturers need to strike a good balance between hardware-based and software-based thermal management strategies to avoid overdesign and minimize the

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Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New

Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New
by Admin on 01-11-2023 at 3:50 pm

Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak.

TIME:
MARCH 1, 2023
11 AM EST

About This Webinar

Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics

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Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT

Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT
by Admin on 08-22-2022 at 2:56 pm

Customer Spotlight Webinar with Webasto

We’ll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs.

TIME:
SEPTEMBER 21, 2022
9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET 

About this

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Ansys 2022 R2: What’s New in Ansys Icepak

Ansys 2022 R2: What’s New in Ansys Icepak
by Admin on 08-22-2022 at 2:14 pm

AEDT Icepak 2022 R2 features enhanced meshing workflows for slider bar meshing to accommodate more complex geometries. Register for this webinar and see the new features for enhanced productivity and advanced modeling.

TIME:

SEPTEMBER 12, 2022
2 AM EDT / 7 AM BST / 11:30 AM IST

About This Webinar

For many years, Icepak has played

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Webinar: Ansys 2022 R2: What’s New in Ansys Icepak & Mechanical in AEDT

Webinar: Ansys 2022 R2: What’s New in Ansys Icepak & Mechanical in AEDT
by Admin on 08-22-2022 at 1:59 pm

Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT. The 2022 R2 update will describe the new features & capabilities of the Icepak and Mechanical Thermal simulators in detail.

Time:
September 6, 2022
11 AM EDT / 4 PM BST / 8:30 PM IST

Venue:
Virtual

About this Event

Thermal and Mechanical

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ANSYS Icepak and Sherlock For Temperature Cycling

ANSYS Icepak and Sherlock For Temperature Cycling
by Admin on 01-07-2020 at 2:20 pm

March 24, 2020

12:00 PM – 1:00 PM (EDT)

Venue: Online

Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical… Read More


Thermal and Reliability in Automotive

Thermal and Reliability in Automotive
by Bernard Murphy on 06-12-2018 at 7:00 am

Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More


Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More