Join us for a 4-day in-person introductory training on four comprehensive simulation solutions.
Register to attend one or all four sessions. Space is limited, so sign up today to save your spot.
*Lunch will be provided for each session.
Date:
Tuesday, May 7, 2024 – Friday,… Read More
Every electromagnetic simulation needs material properties as an input. The accuracy of the material data has a direct impact on the accuracy of your simulation.
Ansys Granta offers Material Data for Simulation (MDS) for Ansys Electronics Desktop tools like Ansys Maxwell, Ansys HFSS, and Ansys Icepak with a wide range of low… Read More
Every electromagnetic simulation needs material properties as an input. The accuracy of the material data has a direct impact on the accuracy of your simulation.
Ansys Granta offers Material Data for Simulation (MDS) for Ansys Electronics Desktop tools like Ansys Maxwell, Ansys HFSS, and Ansys Icepak with a wide range of low… Read More
See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.
The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal.
TIME:
MARCH 22, 2023
11 AM EDT / 3 PM GMT / 8:30 PM IST
Venue:
Virtual
The 2023 R1 release for Ansys Icepak offers
The ever-increasing need for faster, smaller, and multi-tasking electronic devices poses a significant thermal management challenge for the processor and the system. Manufacturers need to strike a good balance between hardware-based and software-based thermal management strategies to avoid overdesign and minimize the
Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak.
TIME:
MARCH 1, 2023
11 AM EST
Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics
We’ll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs.
TIME:
SEPTEMBER 21, 2022
9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET
About this
AEDT Icepak 2022 R2 features enhanced meshing workflows for slider bar meshing to accommodate more complex geometries. Register for this webinar and see the new features for enhanced productivity and advanced modeling.
TIME:
SEPTEMBER 12, 2022
2 AM EDT / 7 AM BST / 11:30 AM IST
About This Webinar
For many years, Icepak has played
Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT. The 2022 R2 update will describe the new features & capabilities of the Icepak and Mechanical Thermal simulators in detail.
Time:
September 6, 2022
11 AM EDT / 4 PM BST / 8:30 PM IST
Venue:
Virtual
About this Event
Thermal and Mechanical
