Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New

Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New
by Admin on 01-11-2023 at 3:50 pm

Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak.

TIME:
MARCH 1, 2023
11 AM EST

About This Webinar

Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics

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Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT

Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT
by Admin on 08-22-2022 at 2:56 pm

Customer Spotlight Webinar with Webasto

We’ll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs.

TIME:
SEPTEMBER 21, 2022
9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET 

About this

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Ansys 2022 R2: What’s New in Ansys Icepak

Ansys 2022 R2: What’s New in Ansys Icepak
by Admin on 08-22-2022 at 2:14 pm

AEDT Icepak 2022 R2 features enhanced meshing workflows for slider bar meshing to accommodate more complex geometries. Register for this webinar and see the new features for enhanced productivity and advanced modeling.

TIME:

SEPTEMBER 12, 2022
2 AM EDT / 7 AM BST / 11:30 AM IST

About This Webinar

For many years, Icepak has played

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Webinar: Ansys 2022 R2: What’s New in Ansys Icepak & Mechanical in AEDT

Webinar: Ansys 2022 R2: What’s New in Ansys Icepak & Mechanical in AEDT
by Admin on 08-22-2022 at 1:59 pm

Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT. The 2022 R2 update will describe the new features & capabilities of the Icepak and Mechanical Thermal simulators in detail.

Time:
September 6, 2022
11 AM EDT / 4 PM BST / 8:30 PM IST

Venue:
Virtual

About this Event

Thermal and Mechanical

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ANSYS Icepak and Sherlock For Temperature Cycling

ANSYS Icepak and Sherlock For Temperature Cycling
by Admin on 01-07-2020 at 2:20 pm

March 24, 2020

12:00 PM – 1:00 PM (EDT)

Venue: Online

Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical… Read More


Thermal and Reliability in Automotive

Thermal and Reliability in Automotive
by Bernard Murphy on 06-12-2018 at 7:00 am

Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More


Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More


FinFET Designs Need Early Reliability Analysis

FinFET Designs Need Early Reliability Analysis
by Pawan Fangaria on 02-19-2015 at 9:30 pm

In a world with mobile and IoT devices driven by ultra-low power, high performance and small footprint transistors, FinFET based designs are ideal. FinFETs provide high current drive, low leakage and high device density. However, a FinFET transistor is more exposed to thermal issues, electro migration (EM), and electrostatic… Read More


Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More