TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More
Tag: ic packaging
Tools for Advanced Packaging Design Follow Moore’s Law, Too!
There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More
Chips and pins and layers within
After teams sweat the details of SoC and industrial design, they turn to printed circuit board designers for magic. Here are a pile of chips and passives, and a schematic for interconnecting them. This is how much physical space the board can occupy. Connectors have to be here, and here, and mounting holes there, and there. There … Read More
Podcast EP4: Can China Really Become Self-Sufficient in Semiconductors?