The introduction of direct die-to-die bonding technology into high volume production has the potential to substantially affect the evolution of the microelectronics industry. The concerns relative to the “end of Moore’s Law”, the diminishing returns of continued (monolithic) CMOS process scaling, and the disruptive effect… Read More
IEEE Hybrid Bonding Symposium
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA
Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx.
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Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for … Read More