High-NA EUV has received a lot of attention ever since Intel put the spotlight on its receiving the first 0.55 NA EUV tool from ASML [1], expected in 2025. EUV itself has numerous issues which have been enumerated by myself and others, most notoriously the stochastic defects issue. There are also a host of issues related to the propagation… Read More
-Intel’s access to high-NA EUV tools may be their elixir of life
-TSMC’s EUV adoption helped it vault faltering Intel & Samsung
-Maybe ASML should invest in Intel like Intel invested in ASML
-Shoe is on the other foot- But cooperation helps chip industry
Intel is dependent upon ASML for its entire future
If Intel… Read More
The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers. Of particular importance is the chemistry of the photoresist materials and their interaction… Read More
