In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’s… Read More
Tag: HBM3
Accelerate AI Performance with 9G+ HBM3 System Solutions
In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More
Alphawave Semiconductor Powering Progress
Do you know who had another great year? Alphawave Semi did. Despite being relatively young in the industry (founded in 2017), the company has quickly gained recognition for its advancements in high-speed connectivity solutions.
They specialize in developing high-speed connectivity solutions for Data centre, AI, 5G wireless… Read More
High-End Interconnect IP Forecast 2022 to 2026
The Interface IP market has grown with 21% CAGR from 2017 to 2021 and we review the part of this market restricted to the high-end of PCIe, DDR, Ethernet and D2D IP made of PHY and controller targeting the most advanced technology nodes and latest protocol release. We will show that an IP vendor focusing investment on the high-end interconnect… Read More
Alchip Technologies Offers 3nm ASIC Design Services
Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More
S2C’s FPGA Prototyping Solutions
Prototyping solutions have been in the news a lot lately. And FPGA-based prototyping approach is pretty widely used. On a panel session at DAC 2021, Amir Salek, Head of Silicon for Cloud and Infrastructure at Google had the following to say. Prototyping FPGA is a tremendous platform for testing and validation. We are doubling down… Read More
Upcoming Webinar: 3DIC Design from Concept to Silicon
Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions
We live in the age of big data. No matter how fast and complex modern SoCs are, it all comes down to how quickly data can get in and out that determines the system performance. And, there is a lot of data that today’s systems need to process. Naturally, system interfaces such as PCIe, DDR, HBM, etc., have been evolving rapidly too, to support… Read More