Semiconductor IP Becomes A Critical Element in ASIC Design

Semiconductor IP Becomes A Critical Element in ASIC Design
by Daniel Nenni on 02-19-2012 at 4:05 pm

Clearly one of the market trends proving troublesome in the traditional ASIC value chain is the lack of silicon correlated custom IP. And make no mistake, semiconductor IP is a critical decision since it drives both chip level and system level technology differentiation.

Under the traditional ASIC model, vendors had their own… Read More


Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!
by Daniel Nenni on 01-29-2012 at 4:00 pm

The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.

Here, at the junction of advanced design, process technology and state-of-the art … Read More


Semiconductor IP Dilemma?

Semiconductor IP Dilemma?
by Daniel Nenni on 01-01-2012 at 3:00 pm

Just how many hands have touched your SoC design by the time it goes to manufacturing? Clearly the more hands that touch it, the more complex the design is, making it more difficult to meet your product requirements. The commercial semiconductor IP dilemma is that not only are you using the same IP as your competitors, you are exponentially… Read More


Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!

Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!
by Daniel Nenni on 12-04-2011 at 7:00 pm

Just returning from my monthly trip to Taiwan and I find myself energized! Semiconductors, EDA, and the ASIC business have never been more exciting! The travel itself is not so exciting but since I make frequent trips the airline and hotel treat me like a king. And let me tell you, it is good to be a king!

Speaking of royalty, I saw Dr. Read More


TSMC ASIC versus IBM ASIC!

TSMC ASIC versus IBM ASIC!
by Daniel Nenni on 10-30-2011 at 3:00 pm

Lunch with Jim Lai, President of Global Unichip(GUC), was the highlight of my week, I had a very nice crab cake salad. As you may have read, GUC announced itself as the “Flexible ASIC Leader” taking direct aim at the traditional ASIC market led by the likes of IBM, ST Micro, TI, Renesas, and Samsung. This will be like “shooting fish inRead More