The Interface IP Market has Grown to $530 Million!

The Interface IP Market has Grown to $530 Million!
by Eric Esteve on 10-22-2017 at 7:00 am

According with IPnest, the Interface IP market, including USB, PCI Express, (LP)DDRn, HDMI, MIPI and Ethernet IP segments, has reached $532 million in 2016, growing from $472 million in 2015. This is an impressive 13% Year-over-Year growth rate, and 12% CAGR since 2012!



Who integrate functions to interface a chip with others Read More


Design IP including Multi-standard SerDes enables risk-free, faster customer ASIC designs

Design IP including Multi-standard SerDes enables risk-free, faster customer ASIC designs
by Eric Esteve on 02-01-2013 at 8:25 am

ASIC design service companies are an essential piece of the SC ecosystem, as well as Silicon Foundries, EDA and IP vendors. Their customers range from pure fabless with no ASIC design resources, who need a third party to turn a concept into a real product (IC) and then market and sale it, to large IDM temporarily lacking design resource… Read More


A Brief History of Today’s Flexible ASIC Model

A Brief History of Today’s Flexible ASIC Model
by Daniel Nenni on 10-25-2012 at 8:10 pm

Image RemovedThere’s been an interesting trend emerging the past couple of years; a gentrification, if you will, of the ASIC business. What was thought to be a dying supply chain model has re-emerged as a health and growing segment of the semiconductor industry. Recent figures from Gartner place 2012 ASIC revenue at around… Read More


The Total ARM Platform!

The Total ARM Platform!
by Daniel Nenni on 07-24-2012 at 7:30 pm

Image RemovedIn the embedded world that drives much of today’s ASIC innovation, there is no bigger name than ARM. Not to enter the ARM vs. Intel fray, but it’s no exaggeration to say that ARM’s impact on SoCs is as great as Intel’s on the PC. Few cutting edge SoCs are coming to market that do not include some… Read More


TSMC: Production Proven Design Services Driving SoC Innovation!

TSMC: Production Proven Design Services Driving SoC Innovation!
by Daniel Nenni on 07-06-2012 at 8:30 pm

Image RemovedOne of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is… Read More


Flexible ASIC Strategy!

Flexible ASIC Strategy!
by Daniel Nenni on 04-21-2012 at 9:00 pm

During my last Taiwan trip I also spent time with Global Unichip. Clearly, in order for the semiconductor industry to thrive we must enable design starts. With the rising costs and complexity of semiconductor design and manufacturing this is a much greater challenge which is why I’m so interested in GUC, for the greater good of the… Read More


Semiconductor IP Becomes A Critical Element in ASIC Design

Semiconductor IP Becomes A Critical Element in ASIC Design
by Daniel Nenni on 02-19-2012 at 4:05 pm

Image RemovedClearly one of the market trends proving troublesome in the traditional ASIC value chain is the lack of silicon correlated custom IP. And make no mistake, semiconductor IP is a critical decision since it drives both chip level and system level technology differentiation.

Under the traditional ASIC model, vendors… Read More


Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!
by Daniel Nenni on 01-29-2012 at 4:00 pm

Image Removed The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.

Here, at the junction of advanced design, process technology and state-of-the… Read More


Semiconductor IP Dilemma?

Semiconductor IP Dilemma?
by Daniel Nenni on 01-01-2012 at 3:00 pm

Just how many hands have touched your SoC design by the time it goes to manufacturing? Clearly the more hands that touch it, the more complex the design is, making it more difficult to meet your product requirements. The commercial semiconductor IP dilemma is that not only are you using the same IP as your competitors, you are exponentially… Read More


Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!

Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!
by Daniel Nenni on 12-04-2011 at 7:00 pm

Just returning from my monthly trip to Taiwan and I find myself energized! Semiconductors, EDA, and the ASIC business have never been more exciting! The travel itself is not so exciting but since I make frequent trips the airline and hotel treat me like a king. And let me tell you, it is good to be a king!

Speaking of royalty, I saw Dr. Read More