2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
Tag: guc
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences
Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.
See the full online conference agenda and list of speakers at www.ansys.com/IDEAS. The free registration will… Read More
proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More
The ASIC Business is Surging!
Application Specific Integrated Circuits were the foundation of the semiconductor industry up until the IDMs came to power in the 1980s and 90s. Computer companies all had their own fabs, I worked in one, until start up companies like SUN Microsystems started using off the shelf chips from Motorola. SUN moved to the fabless model… Read More
The Interface IP Market has Grown to $530 Million!
According with IPnest, the Interface IP market, including USB, PCI Express, (LP)DDRn, HDMI, MIPI and Ethernet IP segments, has reached $532 million in 2016, growing from $472 million in 2015. This is an impressive 13% Year-over-Year growth rate, and 12% CAGR since 2012!
Who integrate functions to interface a chip with others … Read More
Design IP including Multi-standard SerDes enables risk-free, faster customer ASIC designs
ASIC design service companies are an essential piece of the SC ecosystem, as well as Silicon Foundries, EDA and IP vendors. Their customers range from pure fabless with no ASIC design resources, who need a third party to turn a concept into a real product (IC) and then market and sale it, to large IDM temporarily lacking design resource… Read More
A Brief History of Today’s Flexible ASIC Model
There’s been an interesting trend emerging the past couple of years; a gentrification, if you will, of the ASIC business. What was thought to be a dying supply chain model has re-emerged as a health and growing segment of the semiconductor industry. Recent figures from Gartner place 2012 ASIC revenue at around $24.4 billion… Read More
The Total ARM Platform!
In the embedded world that drives much of today’s ASIC innovation, there is no bigger name than ARM. Not to enter the ARM vs. Intel fray, but it’s no exaggeration to say that ARM’s impact on SoCs is as great as Intel’s on the PC. Few cutting edge SoCs are coming to market that do not include some sort of embedded… Read More
TSMC: Production Proven Design Services Driving SoC Innovation!
One of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is difficult, if… Read More