All aspects of semiconductor design and manufacturing require collaboration across a global ecosystem. As complexity increases, so does the importance of good collaboration. This is especially true for advanced package design. Thanks to the movement to multi-die design, package development has become an incredibly difficult… Read More
Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More
The internet keeps adding users and connected devices. According to the numbers in a white paper from Achronix, by 2022 there will be 4.8 billion internet users and 28.5 billion connected devices. Internet traffic will reach 275 exabytes per month. Of this a staggering 83 percent will be video traffic. Moving the data from creators… Read More
This blog is my second blog from this year’s Linley Fall Processor Conference. The first two blogs focused on edge inference solutions. Achronix’s discussion was much broader than just AI/ML; it was about where FPGA’s have been going and culminated with a product announcement preview. I’ll get to the announcement in a moment, … Read More
No, I’m not going to talk about in-memory-compute architectures. There’s interesting work being done there but here I’m going to talk here about mainstream architectures for memory support in Machine Learning (ML) designs. These are still based on conventional memory components/IP such as cache, register files, SRAM and various… Read More
On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees.
This is the second part of the review of Jeongdong’s talk, we covered NAND flash technology in the last post. Jeongdong is a Senior Technical… Read More
In the wake of TSMC’s recent Open Innovation Platform event, I spoke to Frank Ferro, Senior Director of Product Management at Rambus. His presentation on advanced memory interfaces for high-performance systems helped to shed some light on the evolution of system memory for leading edge applications. System implementers now… Read More
