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In High-NA EUV lithography systems, the numerical aperture (NA) is expanded from 0.33 to 0.55. This change has been marketed as allowing multi-patterning on the 0.33 NA EUV systems to be avoided. Only very recently have specific examples of this been provided [1]. In fact, it can be shown that double patterning has been implemented… Read More
The occurrences of notorious stochastic defects in EUV lithography have resulted in CD or corresponding dose windows with the lower and higher bounds being characterized as “cliffs” [1-3], since the defect density increases exponentially when approaching these bounds. The defects at lower doses have been attributed to the… Read More
