Peak probability at zero distance actually makes no sense
In lithography, it is often stated that the best resolution that can be achieved depends on wavelength and numerical aperture (NA), but this actually only applies to the so-called “aerial” image. When the image is actually formed in the resist layer, it also depends on an… Read More
Whether EUV or DUV doesn’t matter at 20 nm pitch
The International Roadmap for Devices and Systems, 2022 Edition, indicates that the “2nm” node due in 2025 (this year) has a minimum (metal) half-pitch of 10 nm [1]. This is, in fact, less than the resolution of a current state-of-the-art EUV system, with a numerical aperture… Read More
Previously, I had indicated how detrimental stochastic effects at pitches below 50 nm should lead to reconsidering the practical resolution limit for EUV lithography [1]. This is no exaggeration, as stochastic effects have been observed for 24 nm half-pitch several years ago [2,3]. This then leads to the question of whether … Read More
– Lam reports another flat quarter & guide- No recovery in sight yet
– Seems like no expectation of recovery until 2025- Mixed results
– DRAM good- NAND weak- Foundry/Logic mixed-Mature weakening
– Clearly disappointing to investors & stock hoping for a chip recovery
On Friday April 12th Intel held a press briefing on their adoption of High NA EUV with Intel fellow and director of lithography Mark Phillips.
In 1976 Intel built Fab 4 in Oregon, the first Intel fab outside of California. With the introduction of 300mm Oregon became the only development site for Intel with large manufacturing, development,… Read More
ASML- better EPS but weaker revenues- 2024 recovery on track
China jumps 10% to 49%- Memory looking better @59% of orders
Order lumpiness increases with ASP- EUV will be up-DUV down
“Passing Bottom” of what has been a long down cycle
Reported revenue was Euro5.3B and EPS of Euro3.11… Read More
The majority of EUV production is on 5nm and 3nm node, implemented by late 2022. Metal oxide resists have not been brought into volume production yet [1,2], meaning that only organic chemically amplified resists (CARs) have been used instead until now. These resists have a typical absorption coefficient of 5/um [3,4], which means
The discussion of any particular lithographic application often refers to imaging a single pitch, e.g., 30 nm pitch for a 5nm-family track metal scenario. However, it is always necessary to confirm the selected patterning techniques on the actual use case. The 7nm, 5nm, or 3nm 6-track cell has four minimum pitch tracks, flanked… Read More
– Lam reported as expected and guided flat- No recovery yet
– Some mix shifts but China still 40% (8X US at 5%)-NVM still low
– HBM is promising but Lam needs a broad memory recovery
– Lam has not seen order surge ASML saw- Likely lagging by 3-4 QTRs
As compared… Read More
– ASML orders more than triple sequentially- Utilization increases
– Management remains conservative with flat revenues 2024 vs 2023
– Recovery will be slow, targeting 2025- Long & weak cyclical bottom
– Litho orders are leading indicator of future wider recovery
