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Thursday, November 5, 2026
11:00am PST | 2:00pm EST | 20:00 CET
As SoCs evolve into multi-die systems, getting data across a die-to-die interface is only part of the challenge. Architects must also preserve traffic behavior, bandwidth efficiency and quality of service as communication moves across physical chip boundaries.
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Description
AI is no longer just running on the system—it’s reshaping how the system is designed. Agentic AI is changing the demands on chips, architectures, memory, networking, software, and the entire compute stack. From AI-native silicon and advanced packaging to intelligent system architectures and autonomous design
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Artificial Intelligence (AI) is dominating the news cycle these days. It used to be about the latest (and largest) chips to accelerate AI algorithms. While that’s still relevant and exciting, AI news is taking a much broader, socioeconomic character. What does AI mean for job security, the economy, or even life on Earth? These … Read More
When you looked at a chip in the past you primarily were concerned with two things: the speed of the chip, usually expressed in GHz, and how much power it consumed. Today the IBM engineers preparing the newest POWER chip, the 14nm POWER9, are tweaking the chips for the different workloads it might run, such as cognitive or cloud, and… Read More
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More