Meet the POWER9 Chip Family

Meet the POWER9 Chip Family
by Alan Radding on 09-30-2016 at 12:00 pm

When you looked at a chip in the past you primarily were concerned with two things: the speed of the chip, usually expressed in GHz, and how much power it consumed. Today the IBM engineers preparing the newest POWER chip, the 14nm POWER9, are tweaking the chips for the different workloads it might run, such as cognitive or cloud, andRead More


“Thinking Outside the Chip”

“Thinking Outside the Chip”
by Students@olemiss.edu on 04-13-2016 at 7:00 am

While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More