3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
The EDA CEO outlook took an interesting turn last night but before I get into that I will offer a few comments about the start of the show. I attend this event every year for the content but also for the networking. It isn’t everyday you get to hang out with semiconductor industry elite and have candid conversations over food and drinks.… Read More
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More
