Tag: cooling

Webinar: Simulation for Data Center Cooling Infrastructure

Webinar: Simulation for Data Center Cooling Infrastructure
by Admin on 09-03-2026 at 1:50 am

AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency targets. Join this webinar to explore how simulation supports faster decisions, reduced risk, improved

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New Cooling Strategies for Future Computing

New Cooling Strategies for Future Computing
by Daniel Payne on 07-17-2025 at 10:00 am
Categories: Cadence, EDA

thermal panel dac min

Power densities on chips increased from 50-100 W/cm2 in 2010 to 200 W/cm2 in 2020, creating a significant challenge in removing and spreading heat to ensure reliable chip operation. The DAC 2025 panel discussion on new cooling strategies for future computing featured experts from NVIDIA Research, Cadence, ESL/EPFL, the University… Read More

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Perspectives from Cadence on Data Center Challenges and Trends

Perspectives from Cadence on Data Center Challenges and Trends
by Bernard Murphy on 04-23-2025 at 6:00 am
Categories: AI, Cadence, EDA

Cadence Data Center Report Image

From my vantage point in the EDA foxhole it can be easy to forget that Cadence also has interests in much broader technology domains. One of these is in data center modeling and optimization, through their Cadence Reality Digital Twin Platform. This is an area in which they already have significant track record collaborating with… Read More

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Managing Power at Datacenter Scale

Managing Power at Datacenter Scale
by Bernard Murphy on 04-15-2024 at 6:00 am
Categories: AI, Analytics, proteanTecs

Managing Power at Datacenter Scale

That datacenters are power hogs is not news, especially now AI is further aggravating this challenge. I found a recent proteanTecs-hosted panel on power challenges in datacenter infrastructure quite educational both in quantifying the scale of the problem and in understanding what steps are being taken to slow growth in power… Read More

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Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am
Categories: Ansys, Inc., Automotive, EDA, Events

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More

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Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm
Categories: Ansys, Inc., EDA

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More