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Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,
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AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More
See Agile Analog at DAC in the EE Times Chiplet Pavilion (Booth 2308, Level 2)
Learn how to enhance security and performance with our customizable analog IP
Agile Analog is delighted to announce that we will be back exhibiting at the Design Automation Conference (DAC). Come join us in the EE Times Chiplet Pavilion (booth 2308) to … Read More
Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More
Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit. He also serves as Senior Vice President, Business Development. Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC. He holds… Read More
Anna Fontanelli, CEO of MZ Technologies, is a silicon executive with more than 35 years of expertise in managing complex R&D organizations/programs to give birth to innovative EDA technologies. Strong communication skills and proven ability to lead distributed, cross functional teams in international environments.… Read More
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
Keysight, with deep roots tracing back to Hewlett-Packard, has long been at the forefront of innovation in electronic design and testing. It manufactures electronics test and measurement equipment and software. The company also owns its own foundry and makes custom chips and packages for its instrumentation business. Many… Read More