Multi-die system design is clearly gaining momentum. Part of this momentum focuses on chiplets and a chiplet ecosystem. A “building block” approach for design will work better if there is a way to get verified, quality building blocks in the form of chiplets. The recent Chiplet Summit became an epicenter for this topic. The conference… Read More
Tag: Chiplet Multi-Die
How Intel, Samsung and TSMC are Changing the World
Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore. Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More
Takeaways from SNUG 2023
Synopsys pulled out all the stops for this event. I attended the first full day, tightly scripted from Aart’s keynote kick off to 1×1 interviews with Synopsys executives to a fireside chat between Sassine Ghazi (President and COO) and Rob Aitken (ex-Fellow at Arm, now Distinguished Architect at Synopsys). That’s a lot of … Read More
Multi-Die Systems Key to Next Wave of Systems Innovations
These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More