This year’s Kaufman award winner is Chenming Hu. In contrast to previous years, this was presented on the Sunday evening of DAC instead of at a separate event in San Jose. Chenming’s career was reviewed by Klaus Schuegraf, Group Vice President of EUV Product Development at Cymer, Inc (now part of ASML) and also one of… Read More
Tag: chenming hu
Mentor Graphics’ Best User2User Ever
Calling all Mentor users! Don’t forget to register for the U2U in San Jose on Thursday, April 25.
In addition to three worthy keynotes, you will find a more interactive and solution-focused day than in the past. There are sessions on place & route, custom/AMS, emulation, test and yield analysis, functional verification, Calibre… Read More
Phil Kaufman Award Recipient 2013: Chenming Hu
This year’s recipient of the Kaufman Award is Dr Chenming Hu. I can’t think of a more deserving recipient. He is the father of the FinFET transistor which is clearly the most revolutionary thing to come along in semiconductor for a long time. Of course he wasn’t working alone but he was the leader of the team at UC… Read More
ARM TechCon 2012 Trip Report
I must say the ARM conference gets better every year, as do the attendance numbers. More than 4,000 people showed up including 5 SemiWiki bloggers, two of which I had not yet had the pleasure of meeting.
First I have to mention my favorite vendor booth. I don’t remember what company it was but the girls in fishnet stockings giving out… Read More
Industry Standard FinFET versus Intel Tri-Gate!
Ever since the “Intel Reinvents Transistors Using New 3-D Structure” PR campaign I have been at odds with them. As technologists, I have nothing but respect for Intel. The Intel PR department, however, quite frankly, is evil. Correct me if I’m wrong here but Intel did not “reinvent” the transistor. Nor did they come up with the name… Read More
TSMC Versus Intel: The Race to Semiconductors in 3D!
While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor… Read More