Steven Woo, Fellow and Distinguished Inventor presented at the just concluded Linley Spring Processor Conference a talk about AI in the Era of Connectivity. As he put it, the world is becoming increasingly connected, with a marked surge of digital data, causing a dependence on said data. With the explosion of digital data and AI,… Read More
During the SoC Design Session at the just concluded Linley Spring Processor Conference in Santa Clara, Carlos Macian, Senior Director AI Strategy and Products at eSilicon, held a talk entitled ‘Opposites Attract: Customizing and Standardizing IP Platforms for ASIC Differentiation’.
Standardization is key to IP in modern … Read More
Dr. Cheng Wang, Co-Founder and SVP Engineering at Flex Logix, presented the second talk in the ‘AI at the Edge’ session, at the just concluded Linley Spring Processor Conference, highlighting the InferX X1 Inference Co-Processor’s high throughout, low cost, and low power. He opened by pointing out that existing inference solutions… Read More
During the afternoon session of the Symposium, Jack Kang, SiFive VP sales then addressed the RISC-V Core IP for vertical markets from consumer/smart home/wearables to storage/networking/5G to ML/edge. Embedding intelligence from the edge to the cloud can occur with U Cores 64-bit Application Processors, S Cores 64-bit Embedded… Read More
SiFive held a RISC-V Technology Symposium on February 26 at the Computer History Museum in Mountain View. Keith Witek, SiFive SVP Corporate Development and Strategy kicked off the event and introduced the first keynote speaker Martin Fink, Western Digital CTO, at the time acting CEO of the RISC-V Foundation (as of this writing,… Read More
At the recent DesignCon 2019 in Santa Clara, I attended a couple of sessions where Cadence and their research partners provided some insight on machine learning/AI and on large system design analysis; with the first one focused on real-world cloud & machine learning/AI deployment for hardware design and the second one focused… Read More
High-speed design requires addressing signal integrity (SI) and power integrity (PI) challenges. Power integrity has a frequency component. The Power Distribution Network (PDN) in designs has 2 different purposes: providing power to the chip, and acting as a power plane reference for transmission-line like propagating … Read More
In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More
These were the closing words Yunsup Lee, CTO, SiFive used at one of the December RISC-V Summit Keynotes entitled ‘Opportunities and Challenges of Building Silicon in the Cloud’. Fired up was more the mood among the 1000+ attendees of the RISC-V Summit held at the Santa Clara Convention Center and SiFive was among the companies showcasing… Read More
At the November 14 Cadence Automotive Summit, Ian Dennison, Senior Group Director, outlined sensor enablement technologies and SoC mixed-signal design solutions, from Virtuoso electrically aware design with high current, high reliability, yield and performance tools and methodologies enabling ADAS/AV sensors for vehicle… Read More
