My oldest son just upgraded Smart Phones from a 3″ display to a 4.5″ display and was shocked to discover that his battery barely lasted 8 hours, so I welcomed him to the reality of limited battery life in modern SoC-based mobile devices. There is some hope in increasing battery life for our consumer-oriented devices … Read More
I already talked about how Cadence is splitting Virtuoso into two. Anyway, it is now officially announced. The 6.1 version will continue to be developed as a sort of Virtuoso classic for people doing designs off the bleeding edge that don’t require the new features. And a new Virtuoso 12.1 intended for people doing 20nm and… Read More
In my opinion, FinFETs will be the most significant piece of technology we, as semiconductor ecosystem people, will experience this decade. Seriously this is exciting stuff and one of the top search terms on SemiWiki for 6 months running. Here is a quick peek at what the top EDA companies will be talking about at the Common Platform… Read More
CES is the preeminent gadget show, and in the LVCC South Hall a wave has been building for some time. It’s now the place where chipsets are introduced, and this year saw a wide range of introductions from Atmel, Bosch, Broadcom, Intel (OK, they’re still in Central Hall), InvenSense, Marvell, NVIDIA, Qualcomm, Samsung, ST-Ericsson,… Read More
We will soon start to see the quarterly financial reporting installments of the “Big 3” public EDA companies. I predict they will be as boring as usual. I am not sure if I would want it any differently though.
Back in the 90s there were times when it was truly interesting to wait to see what Cadence, Mentor, or later Synopsys, might announce.… Read More
We all know the concept of “one stop shop”, becoming popular in the Design IP market. The topic we will address today is NOT the “one stop shop”, even if it looks similar, but rather that we could call “consistent design flow”.
What does that means? Simply that, if your SoC design is integrating a DDRn (LPDDR2, DDR3 or even DDR4, let’s… Read More
A couple of weeks ago was the 3D Architectures for Semiconductor Integration and Packagingconference in Redwood City. Cadence presented the changes that they have been making to their tool flow to enabled 2.5D (interposer-based) and true 3D TSV-based designs. You know what TSV stands for by now right? Through-silicon-via, … Read More
We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.
My curiosity kicked in when I looked at the recent press release… Read More
I have participated to a panel during IP-SoC, I must say that “Subsystem IP, myth or Reality” was a great moment. The panel was a mix of mid-size IP vendor (CAST, Sonics), one large EDA (Martin Lund from Cadence), Semiwiki blogger and one large IDM (Peter Hirt from STM) who has very well represented the customer side. And, to make the… Read More
I reviewed the book Mixed-Signal Methodology Guidein August of this year published by Cadence, and decided to follow up with one of the authors, Michael Henrie from ClioSoft, to learn more about the importance of Design Management for AMS. Michael is a Software Engineering Manager at ClioSoft and has worked at Zarlink Semi, Legerity,… Read More
