Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More
Tag: bluetooth
Intelligence at the Edge, Leverage at the Core
Ceva’s second-quarter 2026 performance demonstrates how an intellectual-property supplier converts design activity into high-margin revenue before customer products reach production. Total revenue increased 13% year over year to $29.0 million, led by licensing and related revenue of $18.2 million, up 21% and the highest… Read More
Arteris at DAC 2026 Connecting Innovation for Silicon Success
The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.
Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role… Read More
All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
Bluetooth 6.0 Channel Sounding is Here
I posted a blog on this topic a year ago. Now the Bluetooth Sig has (just) ratified the standard it is timely to provide a reminder on what this new capability can offer. Channel Sounding introduced in Bluetooth Core specification version 6.0 is a method to significantly increase the accuracy of Bluetooth-based distance measurements,… Read More
Battery Sipping HiFi DSP Offers Always-On Sensor Fusion
Earbuds are one of the fastest growing market segments, which is creating the need for audio DSPs with higher performance and a smaller energy footprint. More than just being wireless speakers – earbuds, and wearables for that matter, have become a sophisticated extension of the user interface of phones and laptops, etc.… Read More
CEO Interview: Sivakumar P R of Maven Silicon
Sivakumar P R is the Founder and CEO of Maven Silicon. He is responsible for the company’s vision, overall strategy, business, and technology. He is also the Founder and CEO of Aceic Design Technologies.
Sivakumar is a seasoned engineering professional who has worked in various fields, including electrical engineering,… Read More
IP and Software Speeds up TWS Earbud SoC Development
The global market for earphones and headphones in 2020 is estimated to have been $34B and is expanding at a compound rate of over 20% per year. Of this almost 50% is said to be earphones which are shifting rapidly to True Wireless Stereo (TWS). We have seen the sales of TWS devices grow from 1M units is 2016 to 109M units in 2019, though … Read More
