DFT Innovations Come from Customer Partnerships

DFT Innovations Come from Customer Partnerships
by Tom Simon on 05-05-2020 at 10:00 am

Mentro Tessent Innovation

There is an adage that says that quality is not something that can be slapped on at the end of the design or manufacturing process. Ensuring quality requires careful thought throughout development and production. Arguably this adage is more applicable to the topic of Design for Test (DFT) than almost any other area of IC development… Read More


Synopsys – Turbocharging the TCAM Portfolio with eSilicon

Synopsys – Turbocharging the TCAM Portfolio with eSilicon
by Mike Gianfagna on 04-27-2020 at 10:00 am

Screen Shot 2020 04 18 at 2.21.03 PM

About 90 days ago, Synopsys completed the acquisition of certain IP assets from eSilicon. The remaining entirety of eSilicon was acquired by Inphi Corporation. I was the VP of marketing at eSilicon during that acquisition so it’s very interesting to me to find out how things are going with those certain IP assets.  I got an opportunity… Read More


Automotive Market Pushing Test Tool Capabilities

Automotive Market Pushing Test Tool Capabilities
by Tom Simon on 07-09-2019 at 8:00 am

It’s easy to imagine that the main impetus for automotive electronics safety standards like ISO 26262 is the emergence of autonomous driving technology. However, even cars that do not offer this capability rely heavily on electronics for many critical systems. These include engine control, braking, crash sensors, and stability… Read More


In-System Automotive Test

In-System Automotive Test
by Daniel Payne on 02-01-2018 at 12:00 pm

I’ve been driving cars since 1975 and in the early days we had simplistic gauges for feedback like: Speed, Fuel level, Oil level, RPM. Back then when you popped the hood of a car you could see through the engine compartment onto the ground below, however with today’s cars the engine compartments are crammed with tubes,… Read More


Reducing the Cost of SoC Testing

Reducing the Cost of SoC Testing
by Daniel Payne on 12-16-2016 at 12:00 pm

Every year certain technology themes appear, like at ITC this year a big theme was how to reduce the cost of SoC testing. I spoke with Rob Knoth of Cadence by phone to hear more about this cost of test theme. Rob gave me an example of an SoC that takes 27 seconds on a tester, so at $0.04 per second in test costs amounts to $1.08 per part. If you… Read More


Cadence Adds New Dimension to SoC Test Solution

Cadence Adds New Dimension to SoC Test Solution
by Pawan Fangaria on 02-04-2016 at 7:00 am

It requires lateral thinking in bringing new innovation into conventional solutions to age-old hard problems. While the core logic design has evolved adding multiple functionalities onto a chip, now called SoC, the structural composition of DFT (Design for Testability) has remained more or less same based on XOR-based compression… Read More


What’s Testing Design Limits at ITC?

What’s Testing Design Limits at ITC?
by Beth Martin on 10-02-2015 at 12:00 pm

The 46[SUP]th[/SUP] IEEE International Test Conference (ITC) will be held the week of October 5, 2015 at the Disneyland Hotel Conference Center in Anaheim, California. ITC is where you will discover the latest ideas and learn about practical applications of test technologies.

As you take in panels, tutorials, presentations,… Read More


SoCs in New Context Look beyond PPA – Part2

SoCs in New Context Look beyond PPA – Part2
by Pawan Fangaria on 05-10-2015 at 10:00 am

In the first part of this article, I talked about some of the key business aspects along with some technical aspects like system performance, functionality, and IP integration that drive the architecture of an SoC for its best optimization and realization in an economic sense. In this part, let’s dive into some more aspects that… Read More


Smart Strategies for Efficient Testing of 3D-ICs

Smart Strategies for Efficient Testing of 3D-ICs
by Pawan Fangaria on 02-12-2014 at 6:30 am

3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More


Highest Test Quality in Shortest Time – It’s Possible!

Highest Test Quality in Shortest Time – It’s Possible!
by Pawan Fangaria on 12-26-2013 at 10:30 am

Traditionally ATPG (Automatic Test Pattern Generation) and BIST (Built-In-Self-Test) are the two approaches for testing the whole semiconductor design squeezed on an IC; ATPG requires external test equipment and test vectors to test targeted faults, BIST circuit is implemented on chip along with the functional logic of IC.… Read More