It was an interesting webinar I attended, presented by STMicroelectronicson how they are benefited in power saving and thermal dissipation by using FDSOI technology and also by using PowerArtist in their design. So, it’s an advantage from both sides – semiconductor technology and semiconductor design tool. It’s worth attending… Read More
Today TSMC announced three reference flows that they have been working on along with various EDA vendors (and ARM and perhaps other IP suppliers). The three new flows are:
Designing an LTE modem is an interesting case study in architectural and system level design because it is pretty much on the limit of what is possible in a current process node such as 28nm. I talked to Johannes Stahl of Synopsys about how you would accomplish this with the Synopsys suite of system level tools. He is the first to admit… Read More
At IDF Brian Krzanich gave the keynote. I won’t summarize the whole thing here but just talk about one part that was something they had actually managed to keep secret ahead of time: Quark.
Quark is a synthesizable core. It uses 1/10th power of Atom and is 1/5 size. Now I am writing this, I don’t know if this is a fair comparison… Read More
Ecosystem is everything when it comes to modern semiconductor design, especially if it is mobile. The fabless semiconductor industry has been all about ecosystem since the beginning and that is why we hold supercomputers in our hands today, believe it. After the invention of the transistor in 1947, and the invention of the integrated… Read More
Imagination seems to be well known for a couple of things. Firstly, everyone knows that it is the graphics processor used in the iPhone and the iPad and lots of other phones. And they know that Imagination acquired MIPS at the start of this year.
But what people don’t seem to really appreciate is just what a huge portfolio of IP… Read More
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
Just as important as block RAMs, IO and DSP48’s is what interconnect or fabric is going to be used when considering SoC FPGA designs. I think Xilinx has found the winning combination. What is paramount to the new SoC FPGA methodologies is not only the challenge of moving huge amounts of data around; we are now to consider data… Read More
If you have purchased a high-end cell-phone or tablet in the last couple of years it probably has LTE, although some carriers try and blur things by showing a symbol like 4G when you are in an area that has LTE despite the fact that your phone does not support it. Don’t you love cell-phone marketing? Talking of which, if a camel … Read More
Yesterday was Intel’s Q2 conference call. I think that there are some interesting little pieces of information. The financials were what analysts expected although they did take down their guidance for the rest of the year. But that is never the interesting point of Intel conference calls (they almost always hit guidance).… Read More
