SoC designs are increasingly becoming assemblies of a large number of IP blocks. A well integrated assembly can lead to a successful PPA (Power, Performance and Area) optimized design. However, it is equally important that each IP block is optimized, robust, and integrable in the design. The complexity of an IP and its integration… Read More
An Universe of Formats for IP Validation
Although I knew about Crossfire’s capabilities for signing off quality of an IP before its integration into an SoC, there was much more to learn about this tool when I visited Fractal Technologies booth during this DAC. The complexity handled by this tool to qualify any type of IP for its integration into an SoC can be imagined by the… Read More
Fractal at DAC 2015 – What’s new?
I have been observing Fractal Technologiesexhibiting at DACyear after year, and every year they have demonstrated good value added features in their tools for SoC and IP development. This year at 52[SUP]nd[/SUP] DAC Fractal’s booth number is 1110. Earlier in this year Fractal had added a new ‘Cdiff’ feature in its flagship product… Read More
Noise & Reliability of FinFET Designs – Success Stories!
I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More
How to meet 3Ps in 3D-ICs with sub-20nm Dies?
It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More
How to Assure Quality of Power and SI Verification?
As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More
Power and Reliability Sign-off – A must, but how?
At the onset of SoCs with multiple functionalities being packed together at the helm of technologies to improve upon performance and area; power, which was earlier neglected, has become critical and needs special attention in designing SoCs. And there comes reliability considerations as well due to multiple electrical and … Read More