Tag: apc

Advanced Packaging Conference (APC) 2024

Advanced Packaging Conference (APC) 2024
by Admin on 07-23-2024 at 8:30 pm

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance… Read More

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Semiconductor Fabrication Module Optimization

Semiconductor Fabrication Module Optimization
by Pawan Fangaria on 11-11-2013 at 9:00 am
Categories: Coventor, EDA

The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in … Read More

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How to Quickly Optimize BEOL Process at Your Desk?

How to Quickly Optimize BEOL Process at Your Desk?
by Pawan Fangaria on 09-30-2013 at 11:00 am
Categories: Coventor, EDA

Engineers are always looking to improve the efficiency of how they work, but don’t want to sacrifice accuracy in the process. This is true in the world of semiconductor process development, where traditional build-and-test cycles are both time and resource intensive. But what if there was a way to do certain steps in a ‘virtual’… Read More