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In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More
In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More
Anna Fontanelli, CEO of MZ Technologies, is a silicon executive with more than 35 years of expertise in managing complex R&D organizations/programs to give birth to innovative EDA technologies. Strong communication skills and proven ability to lead distributed, cross functional teams in international environments.… Read More
3D-IC design can be both exciting and frustrating. It’s exciting because it opens a new world of innovation possibilities – opportunities that aren’t constrained by the rules of monolithic chip scaling. It can be frustrating because of the large array of complex technical challenges that must be overcome to make this new paradigm… Read More
MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools are good at what they do. Given a set of constraints, they will deliver a good result. The question is, what is the right set of constraints? … Read More
Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA … Read More
Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA … Read More
