Ansys Multiphysics Platform

Ansys Multiphysics Platform
by Tom Dillinger on 07-26-2021 at 10:00 am

platform communication

Background
Traditionally, the interface between chip designers and system power, packaging, reliability, and mechanical engineering teams was a relatively straightforward exchange of specifications.  Chip designers developed preliminary power dissipation estimates, often based on a simplifying power/mm**2 value. … Read More


A New Problem for High-Performance Mobile

A New Problem for High-Performance Mobile
by Bernard Murphy on 04-04-2018 at 7:00 am

About 6 months ago, ANSYS was approached by a couple of leading mobile platform vendors/suppliers with a challenging problem. These companies were hitting target 2.5GHz performance goals on their (N10 or N7) application processors, but getting about 10% lower yield than expected, which they attributed to performance failures.… Read More