Designing DSP Applications with Versal AI Engines Workshop

Designing DSP Applications with Versal AI Engines Workshop
by Admin on 06-12-2025 at 1:17 pm

Designing DSP Applications with Versal AI Engines Workshop

This workshop covers the AMD Versal AI Engine architecture and using the AI Engine DSP Library, system partitioning, rapid prototyping, and custom coding of AI Engine kernels. Developing AI Engine DSP designs using AMD Vitis Model Composer is also demonstrated.

The

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Webinar: Basic Booting for AMD Zynq and Versal Devices with Practical Tips and Techniques

Webinar: Basic Booting for AMD Zynq and Versal Devices with Practical Tips and Techniques
by Admin on 06-12-2025 at 1:15 pm

Description

BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar.

Are FPGA booting challenges causing frustrating delays and leaving you uncertain about project timelines? Have you spent countless hours wrestling with boot image creation, only to encounter hardware dependencies… Read More


Webinar: Integrating HLS Modules into Block Designs

Webinar: Integrating HLS Modules into Block Designs
by Admin on 06-12-2025 at 1:08 pm

Description

BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar.

Are you struggling to bridge the gap between high-level algorithm design and efficient FPGA implementation? Integrating High-Level Synthesis (HLS) into your Vivado block designs can be a game changer, but many… Read More


Semiconductor Tariff Impact

Semiconductor Tariff Impact
by Bill Jewell on 04-22-2025 at 3:00 pm

US Semiconductor Imports 2024 SemiWiki

President Donald Trump has initially excluded semiconductors from his latest round of U.S. tariffs. However, he could put tariffs on semiconductors in the future. If tariffs are placed on semiconductors imported to the U.S., how would that affect U.S.-based semiconductor companies? The chart below shows U.S. semiconductor… Read More


A Post-AI-ROI-Panic Overview of the Data Center Processing Market

A Post-AI-ROI-Panic Overview of the Data Center Processing Market
by Claus Aasholm on 08-11-2024 at 8:00 am

Datacenter Supply Chain 2024

With all the Q2-24 results delivered, it is time to remove the clouds of euphoria and panic, ignore the performance claims and the bugs, and analyse the Data Center business, including examining the supply chain up and downstream. It is time to find out if the AI boom in semiconductors is still alive.

We begin the analysis with the … Read More


3D IC Design Ecosystem Panel at #61DAC

3D IC Design Ecosystem Panel at #61DAC
by Daniel Payne on 08-05-2024 at 10:00 am

bits per joule min

At #61DAC our very own Daniel Nenni from SemiWiki moderated an informative panel discussion on the topic of 3D IC Design Ecosystem. Panelists included: Deepak Kulkarni – AMD, Lalitha Immaneni – Intel Foundry, Trupti Deshpande – Qualcomm, Rob Aitken – CHIPS, Puneet Gupta – UCLA, Dragomir Milojevic – imec. Each panelist had a brief… Read More


TSMC’s Business Update and Launch of a New Strategy

TSMC’s Business Update and Launch of a New Strategy
by admin on 07-30-2024 at 10:00 am

TSMC Fab Utilization 2024

What looks like a modest market expansion strategy is all but modest.

Insights into the Semiconductor Industry and the Semiconductor Supply Chain.

As usual, when TSMC reports, the Semiconductor industry gets a spray of insights that help understand what goes on in other areas of the industry. This time, TSMC gave more insight … Read More


Will Semiconductor earnings live up to the Investor hype?

Will Semiconductor earnings live up to the Investor hype?
by Claus Aasholm on 07-10-2024 at 10:00 am

NVIDIA Fastest Growing Semiconductor company

The state of the Semiconductor Industry before the earnings season. This post will give the industry’s status before the results are revealed. We are sharing the information available.

The first Q2 swallows
A few companies with quarters not aligned to calendar quarters have reported. Nvidia was slightly ahead of expectations,… Read More


Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions

Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
by Kalar Rajendiran on 06-13-2024 at 10:00 am

The Synopsys Multi Die Solution

Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More