Webinar: Build Your Next HBM2/2E Chip with SiFive

Webinar: Build Your Next HBM2/2E Chip with SiFive
by Mike Gianfagna on 05-04-2020 at 10:00 am

Screen Shot 2020 05 03 at 12.09.58 PM

I have been watching the trend for quite some time now that many advanced FinFET designs today are actually 2.5D systems in package. All of these 2.5D silicon interposer-based designs have high-bandwidth memory (HBM) stacks on board.  Often there are multiple memory stacks in both 4-high and 8-high configurations. If you follow… Read More


Advanced ASICs – It Takes an Ecosystem

Advanced ASICs – It Takes an Ecosystem
by Mike Gianfagna on 11-26-2017 at 2:00 pm

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical… Read More