Heterogeneous Package Design Challenges for ADAS

Heterogeneous Package Design Challenges for ADAS
by Tom Simon on 10-04-2021 at 10:00 am

Hetergeneous Package Design

Increasingly complex heterogeneous packaging solutions have proved essential to meeting the rapidly scaling requirements for automotive electronics. Perhaps there is no better example of this than advanced driver-assistance systems (ADAS) that are found in most new cars. In a recent paper published by Siemens EDA, they … Read More


CEO Interview: Gireesh Rajendran CEO of Steradian Semiconductors

CEO Interview: Gireesh Rajendran CEO of Steradian Semiconductors
by Daniel Nenni on 09-17-2021 at 6:00 am

Gireesh Rajendran

Gireesh Rajendran is a 2010 MIT TR35 winner from India. He holds 44 issued US patents in RF products and circuit techniques and co-authored 3 ISSCC papers. He completed his B Tech in Electronics from College of Engineering, Trivandrum, India in 2000 and joined Texas Instruments. During his 13 years tenure in TI, he architected and… Read More


Upcoming Virtual Event: Designing a Time Interleaved ADC for 5G V2X Automotive Applications

Upcoming Virtual Event: Designing a Time Interleaved ADC for 5G V2X Automotive Applications
by Kalar Rajendiran on 08-03-2021 at 10:00 am

Mohammed Ismail Wayne State University

Over the last decade or so, the automotive industry has been rapidly adopting and deploying innovative and revolutionary technologies in automobiles. One such revolution is the autonomous vehicle technology. While this technology is not fully mature yet, some components of this technology are. Many late model automobiles… Read More


Automotive Safety Island: Test, Safety, Security, ISO 26262

Automotive Safety Island: Test, Safety, Security, ISO 26262
by Daniel Payne on 07-12-2021 at 10:00 am

functional safety

I first fell in love with electric vehicles back in 1978 as an Electrical Engineering student, studying at the University of Minnesota. What caught my fancy was a small advertisement listed in the back of Popular Mechanics magazine to build your own electric vehicle by replacing the gas engine of a Honda with an electric motor, so… Read More


Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements

Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements
by Kalar Rajendiran on 06-01-2021 at 6:00 am

Current GF Nodes Supporting Automotive

During the week of April 19th, Linley held its Spring Processor Conference 2021. The Linley Group has a reputation for putting on excellent conferences. And this year’s spring conference was no exception. There were a number of very informative talks from various companies updating the audience on the latest research and development… Read More


Upping the Safety Game Plan for Automotive SoCs

Upping the Safety Game Plan for Automotive SoCs
by Rich Collins on 05-20-2021 at 10:00 am

Upping the Safety Game Plan for Automotive SoCs

Thanks to advanced hardware and software, smart vehicles are improving with every generation. Capabilities that once seemed far-off and futuristic—from automatic braking to self-driving at the very pinnacle—are now either standard or within reach. However, considering how vehicle architectures have continued to evolve,… Read More


Four key steps to set up a smart and efficient ADAS testing workflow

Four key steps to set up a smart and efficient ADAS testing workflow
by Admin on 04-15-2021 at 12:00 am

LIVE WEBINAR | 15 APRIL 2021 | TWO SESSIONS AVAILABLE

Learn the strategy behind smart ADAS testing

Advanced Driver Assistance Systems (ADAS) such as Adaptive Cruise Control or highway pilots are becoming a standard feature in new vehicles. To increase driver’s safety, car manufacturers worldwide are developing and validating

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AutoSens Conference & Exhibition

AutoSens Conference & Exhibition
by Admin on 11-17-2020 at 12:00 am

The Michigan Science Center5020 John R St, Detroit, MI 48202, USA

http://www.mi-sci.org

 NEW DATES – 17-19 November 2020

In November this year 500 engineers and technologists join AutoSens for a 3-day US edition of the world-class conference in Detroit at
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Guidance of ISO 26262 to Semiconductors

Guidance of ISO 26262 to Semiconductors
by Admin on 09-14-2020 at 12:00 am

New Date: 14 – 17 September 2020 | Detroit, MI

Due to the risk associated with the spread of the coronavirus (COVID-19), we have decided to postpone this conference to September, as the safety and wellbeing of our customers, partners, and employees is our highest priority.

Welcome Letter from Chairman for our Guidance ofRead More