Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han
Dan is joined by Dr. Mark Han, Vice President of R&D Engineering for Circuit Simulation at Synopsys. Mark leads a team of over 300 engineers in developing cutting-edge advanced circuit simulation and transistor-level sign-off products, including characterization and static timing analysis. With 27 years of industry experience, he has a proven track record of driving innovation and growth.
Dan discusses the changing landscape of embedded memory architectures with Mark. High-Bandwidth Memory (HBM) stacks are becoming much more prevalent in semiconductor system design, thanks in part to the substantial demands for high volume and high speed data management required by AI applications.
Mark discusses the ways this type of memory is different from traditional embedded technologies. He discusses the design and verification challenges presented by HBM-based designs. New challenges associated with heat dissipation and mechanical stability are also explored.
Mark describes how Synopsys is using its unique full stack of EDA tools, from TCAD to system architecture to address the growing demands of new memory architectures. He discusses innovations in both speed and accuracy for the Synopsys simulation tools that are making a difference in the design of advanced systems.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
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