Podcast EP223: The Impact Advanced Packaging Will Have on the Worldwide Semiconductor Industry with Bob Patti
Dan is joined by Bob Patti, the owner and President of NHanced Semiconductors. Previously, Bob founded ASIC Designs Inc., an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he participated in more than 100 tapeouts. Tezzaron Semiconductor grew from that company, with Bob as its CTO, and became a leading force in 3DIC technology. Tezzaron built its first working 3DICs in 2004. NHanced Semiconductors was spun out of Tezzaron to further advance and develop 2.5D/3D technologies, chiplets, die and wafer stacking, and other advanced packaging. Bob holds 21 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor chip technologies.
In this broad analysis of the semiconductor industry, Bob discusses the significant impact advanced packaging is having and will have on innovation. The investments being made to bolster US capability in semiconductors is discussed with an evaluation of what areas of advanced packaging are opportunities for US growth.
Bob examines the various 2.5D/3D and mixed material assembly technologies on the horizon. He talks about a future semiconductor industry where “super OSATs” will play a major role in innovation and advanced technology sourcing.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
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