Dan is joined by Paul Fischer. Paul is the director of Chip Mesoscale Processing in Intel’s Components Research. He and his team are currently working on Gallium Nitride for energy efficient power delivery and RF communications, and technologies for heterogeneous monolithic integration.
Paul discusses the innovations he’s seen during his 30-year career at Intel, starting with the 130 nm process node. Paul describes the breadth and depth of material, device and process developments at Intel during his time there.
He discusses some of the advances presented by Intel at the recent IEDM across backside power delivery, vertical transistor stacking, the energy efficiency offered by gallium nitride devices and 2D material innovations. The combination of this work will open new pathways for continued Moore’s Law scaling of devices and systems.
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