The three-step conversational AI (CAI) process – automatic speech recognition (ASR), natural language processing, and text-to-synthesized speech response – is now deeply embedded in the user experience for smartphones, smart speakers, and other devices. More powerful large language models (LLMs) can answer more queries… Read More
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RISC-V and Chiplets: A Panel Discussion
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
- Laurent Moll, COO of Arteris
- Aniket Saha, VP of Product Management of Tenstorrent
- Dale Greenley, VP of Engineering of Ventana
When Will Structured Assembly Cross the Chasm?
First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, … Read More
Using PCB Automation for an AI and Machine Vision Product
I knew that HDMI was a popular standard used to connect consumer products like a monitor to a laptop, but most professional video and broadcast systems use the SDI (Serial Digital Interface) connector standard. Pleora Technologies, founded in 2000, currently serves the machine vision and manufacturing markets, including those… Read More
Automated Constraints Promotion Methodology for IP to Complex SoC Designs
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
WEBINAR: Joint Pre synthesis RTL & Power Intent Assembly flow for Large System on Chips and Subsystems
Nowadays, low power design requirements are key for large SoCs (system on chips) for different applications: AI, Mobile, HPC, etc. Power intent management early in the design flow is becoming crucial to help facing PPA (Power Performance Area) design challenges.
With the increasing complexity of such … Read More
The First Automotive Design ASIC Platform
Alchip Technologies, Ltd. is a company that specializes in ASIC (Application-Specific Integrated Circuit) design and manufacturing. They are known for providing high-performance and customized ASIC solutions for a variety of applications. Alchip works with clients to design and develop integrated circuits that meet specific… Read More
UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation
For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More
Podcast EP197: A Tour of the RISC-V Movement and SiFive’s Contributions with Jack Kang
Dan is joined by Jack Kang of SiFive. As a member of the founding team at SiFive, Jack oversees the Business Development, Customer Experience, and Corporate Marketing groups. He is responsible for strategic business initiatives and partnerships, technical pre-sales activities and post-sales support, and corporate messaging… Read More
CHIPS Act dies because employees are fired – NIST CHIPS people are probationary