The most interesting presentation at the jam-packed TSMC Symposium last week for me was “Advanced Technology Updates” by Dr. BJ Woo. Coincidentally, I met with BJ during my last visit to Fab 12. Much of what we discussed was about TSMC being more aggressive this year but I wasn’t able to really connect the dots until her presentation.… Read More
New Cooling Strategies for Future ComputingPower densities on chips increased from 50-100 W/cm2…Read More
DAC News – proteanTecs Unlocks AI Hardware Growth with Runtime MonitoringAs AI models grow exponentially, the infrastructure supporting…Read More
Sophisticated soundscapes usher in cache-coherent multicore DSPDigital audio processing is evolving into an art…Read More
A Quick Look at Agentic/Generative AI in Software EngineeringAgentic methods are hot right now since single…Read More
Xilinx at NAB: Any Media Over Any Network
The NAB (National Association of Broadcasters) show has just started, April 11-16th in Las Vegas. It covers a very broad range of topics:
As the premier trade association for broadcasters, NAB advances the interests of our members in federal government, industry and public affairs; improves the quality and profitability of … Read More
Cu-Pillar in Advanced Logic Devices
In 2001, flipchip with solder bump was already a dominant technology and it was replacing wire bonding as the main interconnection choice for a growing number of devices. It was offering fine pitch interconnections for increased I/O counts. In the solder bump process, a bump is formed on the chip and on the package substrate and … Read More
From Medical and Wearables to Big Data, in 日本語/한국어/中文
Whether it’s a tiny always-on medical device or a secure cloud network processing Big Data, the Internet of Things (IoT) is bringing new challenges to IC design. Almost by definition an IoT device contains a microcontroller of some sort along with some way of communicating. Unlike our smartphones where we are reasonably happy … Read More
ANSYS Enters the League of 10nm Designs with TSMC
The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More
Starvision Pro: Lattice Semiconductor’s Experience
During SNUG I took the opportunity to chat to Choon-Hoe Yeoh of Lattice Semiconductor about how they use Concept Engineering’s Starvision Pro product. He is the senior director of EDA tools and methodologies there.
Lattice Semiconductor is a manufacturer of low-power, small-footprint, low-cost programmable logic devices.… Read More
Archives from TI’s Baseband Glory – Part 1
In 1992, nearly two years after Britain’s Acorn Computers joined hands with Apple and VLSI to create Advanced RISC Machines or ARM, the semiconductor upstart landed its first major licensing breakthrough. In retrospect, while Apple’s Newton handheld computer had played a key role in creating the ARM venture, Texas… Read More
New oscillator for low-power implantable transceivers
Due to the limitations of implanting a device in the human body, the devices have limited power storage. Using CMOS technology, different circuits and systems design techniques have to be in place to achieve an energy efficient communication interface. This CMOS technology, created by Arash Moradi and Mohamad Sawan, helps to… Read More
FinFET vs FDSOI – Which is the Right One for Your Design?
As a professional conference goer I can see definite trends when it comes to topics and attendance. Thus far this year I have seen a double digit increase in attendance, which is great. The question is why? Why is the fabless semiconductor ecosystem leaving the safety of their cubicles and computer screens in droves to mingle amongst… Read More
TSMC Processes Galore
Today was TSMC’s 2015 North American Technology Symposium. They talked about a lot of things but perhaps the most important was that they gave a lot of details of new processes, new fabs, and volume ramps.… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing