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How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


How Codasip Unleashed CHERI and Created a Paradigm Shift for Secured Innovation

How Codasip Unleashed CHERI and Created a Paradigm Shift for Secured Innovation
by Mike Gianfagna on 01-15-2024 at 6:00 am

How Codasip Unleashed CHERI and Created a Paradigm Shift for Secured Innovation

At the recent RISC-V Summit, Dr. Ron Black, CEO of Codasip unveiled a significant new capability to create a more secure environment for innovation. Rather than re-writing trillions of lines of code to solve the security problem, Ron described a much more practical approach. One that brought a research topic into mainstream deployment.… Read More


Podcast EP203: A Deep Dive on the Growing Impact of Silicon Lifecycle Management with Synopsys’ Randy Fish

Podcast EP203: A Deep Dive on the Growing Impact of Silicon Lifecycle Management with Synopsys’ Randy Fish
by Daniel Nenni on 01-12-2024 at 10:00 am

Dan is joined by Randy Fish, Director of Product Line Management for the Silicon Lifecycle Management (SLM) family at Synopsys. Randy has over 30 years of experience in the EDA, IP and semiconductor industries.

In this broad view of SLM, Randy explains what is special about monitoring and optimizing embedded memories. It turns… Read More


2024 Outlook with Anupam Bakshi of Agnisys

2024 Outlook with Anupam Bakshi of Agnisys
by Daniel Nenni on 01-12-2024 at 6:00 am

Agnisys Company Photo

We have worked with Agnisys for the last two years and it has been a pleasure. Anupam and his team of specification automation experts have pioneered a family of products and solutions for streamlining the generation of the required files for design, software, verification, validation, and documentation for semiconductor development… Read More


CES 2024

CES 2024
by Bill Jewell on 01-11-2024 at 3:00 pm

CES 2024

CES 2024 is being held this week in Las Vegas, Nevada with an estimated 130,000 attendees and over 4,000 exhibitors. CES (previously Consumer Electronics Show) has been held in Las Vegas every year since 1978, except for 2021 due to COVID-19. This was my ninth CES representing Semiconductor Intelligence, with the first in 2012.… Read More


CES 2024 and all things Cycling

CES 2024 and all things Cycling
by Daniel Payne on 01-11-2024 at 10:00 am

UrbanCross min

From the comfort of my home office I attended CES 2024 virtually this week, and collected all the news for cyclists, and it’s mostly all about e-bikes. The total count of e-bike sales now even outnumber EV car sales worldwide, so that growth trend continues. Some 85% of all bikes sold in China are now e-bikes.

e-bikes

This single… Read More


Synopsys Geared for Next Era’s Opportunity and Growth

Synopsys Geared for Next Era’s Opportunity and Growth
by Kalar Rajendiran on 01-11-2024 at 6:00 am

SassineGhazi

As semiconductor industry folks know, Synopsys is a behemoth of a company. At $5.84B in FY2023 revenue (FY Nov-Oct), approximately 20,000 employees and a market cap of about $74B, it leads the silicon-to-systems design solutions space within the industry. From humble beginnings in 1986 as a disruptive startup, the company has… Read More


An Accellera Functional Safety Update

An Accellera Functional Safety Update
by Bernard Murphy on 01-10-2024 at 10:00 am

Fusa interoperability min

In May of 2021 Accellera released a first white paper on the challenges they hope to address with their functional safety standard, together with the scope and goals they set for themselves. One major goal in this effort has been exchange and integration of functional safety data between different tools and flow and particularly… Read More


Analog Bits Enables the Migration to 3nm and Beyond

Analog Bits Enables the Migration to 3nm and Beyond
by Mike Gianfagna on 01-10-2024 at 6:00 am

Analog Bits Enables the Migration to 3nm and Beyond

The world is abuzz with 3nm and 2nm technology availability. These processes offer the opportunity to pack far more on a single die than ever before. The complex digital systems contemplated will bring new AI algorithms to life and much more. But there is another side of the technology migration story.  With all that digital processing… Read More


IEDM: What Comes After Silicon?

IEDM: What Comes After Silicon?
by Paul McLellan on 01-09-2024 at 10:00 am

Screen Shot 2024 01 05 at 8.50.58 AM

The annual International Electron Devices Meeting (IEDM) took place last month. One of the presentations on the short course was by Matthew Metz of Intel titled New Materials Systems for Moore’s Law Continuation. In essence this was a look at some of the possibilities for what comes after silicon runs out of steam.

Matthew started… Read More