My first panel discussion at DAC 2025 was all about using AI for digital implementation, as Siemens has a digital implementation tool called Aprisa which has been augmented with AI to produce better results, faster. Panelists were from Samsung, Broadcom, MaxLinear, AWS and Siemens. In the past it could take an SoC design team… Read More
Reimagining Compute in the Age of Dispersed IntelligenceAt the 2025 RISC-V Summit, amid debates over…Read More
Siemens to Deliver Industry-Leading PCB Test Engineering SolutionsSiemens has strengthened its position in EDA and…Read More
Agentic EDA Panel Review Suggests Promise and Near-Term GuidanceNetApp recently hosted a webinar on Agentic AI…Read More
Hardware is the Center of the Universe (Again)The 40-Year Evolution of Hardware-Assisted Verification — From…Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization EngineEasy-Logic Technology Ltd. is a specialized Electronic Design…Read MoreSynopsys Webinar – Enabling Multi-Die Design with Intel
As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More
CoPoS is a Bigger Canvas for Chiplets and HBM
Is a Semiconductor Equipment Pause Coming?
– Lam put up good numbers but H2 outlook was flat with unknown 2026
– China remains high & exposed at 35% of biz while US is a measly 6%
– Unclear if this is peak, pause, digestion, technology or normal cycle
– Coupled with ASML soft outlook & stock run ups means profit taking
Nice quarter but expected
… Read MoreCEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices
Avi Madisetti is the CEO and Founder of Mixed-Signal Devices, a fabless semiconductor company delivering multi-gigahertz timing solutions. A veteran of Broadcom and Rockwell Semiconductor, Avi helped pioneer DSP-based Ethernet and SerDes architectures that have shipped in the billions. He later co-founded Mobius Semiconductor,… Read More
AI’s Transformative Role in Semiconductor Design and Sustainability
On July 18, 2025, Serge Nicoleau from STMicroelectronics delivered a compelling presentation at DACtv, as seen in the YouTube video exploring how artificial intelligence (AI) is revolutionizing semiconductor design, edge computing, and sustainability. Addressing a diverse audience, Serge highlighted AI’s pervasive … Read More
Google Cloud: Optimizing EDA for the Semiconductor Future
On July 9, 2025, a DACtv session featured a Google product manager discussing the strategic importance of electronic design automation (EDA) and how Google Cloud is optimizing it for the semiconductor industry, as presented in the YouTube video. The talk highlighted Google Cloud’s role in addressing the escalating complexity… Read More
Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use
On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More
Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA
On July 9, 2025, Michael Munsey, VP of Semiconductor Industry at Siemens, and Vishal Moondhra, VP of Solutions at Perforce, presented a DACtv session announcing their strategic partnership, as seen in the YouTube video. This collaboration integrates Siemens’ digital twin and digital thread technologies with Perforce’s version… Read More
AI-Enhanced Chip Design: Pioneering the Future at DAC 2025
On July 9, 2025, a DACtv session illuminated the transformative role of artificial intelligence (AI) in chip design, as presented by Ankur Gupta of Siemens EDA in the YouTube video. The speaker explored how AI is revolutionizing electronic design automation (EDA), addressing the semiconductor industry’s challenges in managing… Read More


Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability