TSMC's 2024 Sustainability Report: Pioneering a Greener Semiconductor FutureTSMC, the world's most trusted semiconductor foundry, released…Read More
Intel's Commitment to Corporate Responsibility: Driving Innovation and SustainabilityIntroduction by Lip-BU Tan: I’m an engineer at…Read More
Cadence's Strategic Leap: Acquiring Hexagon's Design & Engineering BusinessIn a bold move that underscores the accelerating…Read More
TSMC 2025 Update: Riding the AI Wave Amid Global ExpansionWelcome to the second half of a very…Read More
Alchip’s 3DIC Test Chip: A Leap Forward for AI and HPC InnovationToday Alchip Technologies, a Taipei-based leader in high-performance…Read More
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
Dan is joined by Josue Navarro, product marketing engineer for Microchip’s dsPIC business unit. He began his career as a process engineer at Intel and has since transitioned into product marketing with Microchip Technology where he supports customers developing system designs utilizing Microchip’s Digital Signal … Read More
In a bold move that underscores the accelerating convergence of electronic design automation (EDA) and mechanical engineering, Cadence Design Systems announced its agreement to acquire Hexagon AB’s Design & Engineering (D&E) business for approximately €2.7 billion, equivalent to about $3.16 billion. This… Read More
Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.
Today Alchip Technologies, a Taipei-based leader in high-performance and AI computing ASICs, announced a significant milestone with the successful tape-out of its 3D IC test chip. This achievement not only validates Alchip’s advanced 3D IC ecosystem but also positions the company as a frontrunner in the rapidly evolving field… Read More
This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs.
The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More
By Thang Tran
For more than half a century, the foundations of computing have stood on a single architecture: the Von Neumann or Harvard model. Nearly all modern chips—CPUs, GPUs, and even many specialized accelerators—rely on some variant of this design. Over time, the industry has layered on complexity and specialization to… Read More
At the recent Hot Chips conference, Intel® unveiled Clearwater Forest, its next-generation Xeon® 6 processor with efficiency cores (E-cores). The unveiling was made by Don Soltis, Xeon Processor Architect and Intel Fellow with over four decades of processor design experience and a long-standing contributor to the Xeon roadmap.… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet