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Must-attend webinar event: How better collaboration can improve your yield

Must-attend webinar event: How better collaboration can improve your yield
by Daniel Nenni on 03-16-2023 at 10:00 am

YieldHub Webinar

In today’s rapidly evolving semiconductor industry, the demand for high-quality and reliable semiconductors at a reasonable cost is increasing. This is why world-class yield management has become more and more important for fabless semiconductor companies and IDMs.

In a must-attend event, yieldHUB will be hosting… Read More


Accellera Update at DVCon 2023

Accellera Update at DVCon 2023
by Bernard Murphy on 03-16-2023 at 6:00 am

logo accellera min

I have a new-found respect for Lu Dai. He is a senior director of engineering at Qualcomm, with valuable insight into the ground realities of verification in a big semiconductor company. He is on the board of directors at RISC-V International and is chairman of the board of directors at Accellera, both giving him a top-down view of… Read More


Sino Semicap Sanction Screws Snugged- SVB- Aftermath more important than event

Sino Semicap Sanction Screws Snugged- SVB- Aftermath more important than event
by Robert Maire on 03-15-2023 at 10:00 am

China Chip Embargo

-Reports of further tightening of China SemiCap Restrictions
-Likely closing loopholes & pushing back technology line
-Dutch have joined, Japan will too- So far no Chinese reaction
-SVB is toast but repercussions may be far worse

Reports of tightening semiconductor sanctions on Friday

It was reported byBloomberg of Friday… Read More


Scaling the RISC-V Verification Stack

Scaling the RISC-V Verification Stack
by Bernard Murphy on 03-15-2023 at 6:00 am

RISC V verification stack

The RISC-V open ISA premise was clearly a good bet. It’s taking off everywhere, however verification is still a challenge. As an alternative to Arm, the architecture and functionality from multiple IP providers looks very competitive, but how do RISC-V providers and users ensure the same level of confidence we have in Arm? Arm … Read More


JESD204D: Expert insights into what we Expect and how to Prepare for the upcoming Standard

JESD204D: Expert insights into what we Expect and how to Prepare for the upcoming Standard
by Daniel Nenni on 03-14-2023 at 10:00 am

JESD204D SemiWiki Image

Join our upcoming webinar on JESD204 and get insights into what we predict the upcoming JESD204D standard will contain, based on many years of  experience working with JESD204.

Our expert speaker, Piotr Koziuk, has over a decade of experience with JESD204 standards and is a member of the JEDEC Standardization Committee. He will… Read More


Scaling AI as a Service Demands New Server Hardware

Scaling AI as a Service Demands New Server Hardware
by Bernard Murphy on 03-14-2023 at 6:00 am

NLP min

While I usually talk about AI inference on edge devices, for ADAS or the IoT, in this blog I want to talk about inference in the cloud or an on-premises datacenter (I’ll use “cloud” below as a shorthand to cover both possibilities). Inference throughput in the cloud is much higher today than at the edge. Think about support in financial… Read More


MIPI D-PHY IP brings images on-chip for AI inference

MIPI D-PHY IP brings images on-chip for AI inference
by Don Dingee on 03-13-2023 at 10:00 am

Perceive Ergo 2 brings images on-chip for AI inference with Mixel MIPI D-PHY IP

Edge AI inference is getting more and more attention as demand grows for AI processing across an increasing number of diverse applications, including those requiring low-power chips in a wide range of consumer and enterprise-class devices. Much of the focus has been on optimizing the neural network processing engine for these… Read More


SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement

SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement
by Scotten Jones on 03-13-2023 at 8:00 am

Applied Materials Sculpta Presentation for Media Page 06

The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing … Read More


Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson

Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson
by Daniel Nenni on 03-10-2023 at 10:00 am

Dan is joined by Clay Johnson, CEO and co-founder of CacheQ Systems. Clay has more than 25 years of executive management experience across a broad spectrum of technologies including computing, security, semiconductors and EDA tools.

Dan discusses the CacheQ QCC development platform with Clay. This platform enables software… Read More


Cadence Hosts ESD Alliance Seminar on New Export Regulations Affecting EDA and SIP March 28

Cadence Hosts ESD Alliance Seminar on New Export Regulations Affecting EDA and SIP March 28
by Bob Smith on 03-10-2023 at 6:00 am

ESD Alliance Export Seminar 2023

Anyone interested in learning about general trade compliance concepts or how export control and sanction regulations affect the electronic systems design ecosystem will want to attend the upcoming ESD Alliance export seminar. It will be hosted by Ada Loo, chair of the ESD Alliance Export Committee and Cadence’s Group Director… Read More