New Cooling Strategies for Future ComputingPower densities on chips increased from 50-100 W/cm2…Read More
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Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.
Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More
The original vision for Certus Semiconductor in 2008 was to leverage production I/O Libraries from more significant partners, starting with Freescale, and take it to smaller external customers for licensing. This IP was proven and validated, with an excellent silicon track record and big company support; in our minds, we thought,… Read More
I don’t know about you, but when I think of mission-critical applications, I immediately think of space exploration or military operations. But in today’s world, mission-critical applications are all around us. Think about the cloud and how data is managed, analyzed, and shared to execute any number of tasks that have safety … Read More
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
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At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.
Traditionally all interconnects have taken place on the front side of devices with signal and … Read More
Dan is joined by Carl Moore, a Yield Management Specialist at yieldHUB. Carl is a semiconductor and yield management expert with more than 35 years of experience in the industry. Carl has held technical management positions across product and test engineering, assembly, manufacturing, and design.
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Dr. Wei has served as CEO & CTO of Easy-Logic since 2020. Prior to this role, Dr. Wei served as CTO since 2014 where he constructed the core algorithm and the tool structure of EasyECO. As the CEO, Dr. Wei focuses on building a strong company infrastructure. In his CTO role he interfaces with strategic ASIC design customers … Read More
Who first came up with this term shift-left ? I’d assumed Siemens EDA as they use it so widely. But their latest white paper on the productivity improvements possible with shift-left Calibre IC verification flows puts the record straight: a software engineer called Larry Smith bagged the naming rights in a 2001 paper (leapfrogging… Read More
I enjoy talking with CEVA because they work on such interesting consumer products (among other product lines). My most recent discussion was with Seth Sternberg (Sensors and Audio software at CEVA), on spatial or 3D audio. The first steps to a somewhat immersive audio experience were stereo and surround sound, placing sound sources… Read More
Plan ahead now because Friday, June 30, is the deadline to submit nominations for the Phil Kaufman Award and the Phil Kaufman Hall of Fame for anyone you think is deserving of these honors. If you haven’t given it any thought, please consider nominating someone.
Before we look at both and the nomination requirements, here’s a thumbnail… Read More
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