It’s well known that flash is the embedded non-volatile memory (NVM) incumbent technology. As with many technologies, flash is bumping into limits such as power consumption, speed, endurance and cost. It is also not scalable below 28nm. This presents problems for applications such as AI inference engines that require embedded… Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet SummitAt the recent Chiplet Summit, presentations, discussions and…Read More
Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read More
WEBINAR: Reclaiming Clock Margin at 3nm and BelowAt 3nm and below, clock networks have quietly…Read More
WEBINAR: HBM4E Advances Bandwidth Performance for AI TrainingThe rapid proliferation of LLMs and other AI…Read More
Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design EnablementThe recent Chiplet Summit in Santa Clara was…Read MoreWhat are Cloud Flight Plans? Cost-effective use of cloud resources for leading-edge semiconductor design
Embracing cloud computing is highly attractive for users of electronic design automation (EDA) tools and flows because of the productivity gains and time to market advantages that it can offer. For Siemens EDA customers engaged in designing large, cutting-edge chips at advanced nanometer scales, running Calibre® design stage… Read More
AMAT Underwhelms- China & GM & ICAP Headwinds- AI is only Driver- Slow Recovery
- AMAT reports good but underwhelming quarter
- China slowing creates revenue & GM headwinds- ICAPs weak
- AI remains the one and only bright spot in both foundry & memory
- Cyclical recovery remains slow – Single digit Y/Y growth
OK quarter – still slow growing, revs up only 5% Y/Y
AMAT came in at revenues of $6.78B… Read More
Podcast EP241: A Look at Agile Analog IP with Chris Morrison
Dan is joined by Chris Morrison, who has over 15 years of experience in delivering innovative analog, digital, power management and audio solutions for International electronics companies, and developing strong relationships with key partners across the semiconductor industry. Currently he is the Director of Product Marketing… Read More
CEO Interview: Anders Storm of Sivers Semiconductors
Anders Storm is the CEO of Sivers Semiconductors. Under his almost decade-long leadership, the company has experienced significant growth, solidifying its position as a key player in the global semiconductor industry. With expertise in wifi communications, 5G, and photonics, he drives the company’s corporate strategy, … Read More
Emerging Memories Overview
This year’s Future of Memory and Storage Conference (formerly the Flash Memory Summit) was again very well attended. The Santa Clara Convention Center is definitely the place to be for a Silicon Valley Conference.
This post is about the Emerging Memories session organized by Dave Eggleston. We will be covering other sessions… Read More
The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
CEO Interview: Zeev Collin of Semitech Semiconductor
Zeev Collin is a seasoned technology executive and serial entrepreneur with over 25 years of experience in executive management across international semiconductor companies and startups. Prior to co-founding Semitech, Zeev co-founded and successfully exited two ventures focused on vehicle and trailer tracking devices.… Read More
WEBINAR: Silicon Area Matters!
When designing IP for system-on-chip (SoC) and application-specific integrated circuit (ASIC) implementations, IP designers strive for perfection. Optimal engineering often yields the smallest die area, thereby reducing both cost and power consumption while maximizing performance.
Similarly, when incorporating embedded… Read More
First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More


Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era