Project/ Program Manager – Packaging

Job Location:                San Jose, California

Reporting to:                 Director, Field Technical Solutions-Advanced Packaging

We are looking for an enthusiastic colleague to join our Field Technical Solutions team in San Jose. This position entails collaborating with dynamic customers, North American Sales and TSMC Headquarters in Taiwan.  Our mission is to enable customer to quickly and efficiently design their next generation of ‘must have’ products – by understanding their needs and then defining, promoting and enabling the best solution. TSMC, Ltd. is the leader in Semiconductor Foundry business and we are looking for the right individuals and talent to join our FTS advanced packaging team.

Responsibilities

Build relationships and trust with customers through technical interaction.
Own the technical solution for customers and champion their needs.
Justify the packaging business by understanding customers’ products, roadmaps and technical needs in advanced packaging technologies.
Identify and Drive internals teams to develop competitive and creative technical solutions.
Host the engagement meetings between customer and internal teams on initial engineering/technology discussions.
Provide local technical support together with sales team to customers as required.
Train customers on TSMC technology to enable them to create world class products.
Ensure clear and accurate external and internal communication.

Qualifications
Qualifications:

Education: Master’s Degree, or above, in Mechanical Engineering, Materials Science/Engineering, or Electrical Engineering.
Proven, strong technical background with 7+ years of semiconductor packaging industry experience.
Hands-on experiences of advanced packaging technologies, such as flip-chip, BGA, fan-out packages, WLCSP, 3DIC, heterogeneous packages, and other advanced packaging technologies.
Understanding chip-packaging interaction, assembly processes, thermo-mechanical behavior of packages and its materials, electrical performance requirements on packages, and reliability tests are necessary
Knowledge of thermo-mechanical simulation/modeling principles and associated tools; packaging thermal characteristics/thermal dissipation mechanism; electrical SI/PI design principles and simulation; or, packaging design flow and associated EDA tools, is a plus.
Good communication skills and experienced in program/project management.
Self-motivated with a desire to learn.
TSMC North America is an Equal Opportunity Employer.