1. Responsible for new SoIC technology development, including Si wafer handling and process improvement.
2. Project handling and resource allocation.
3. Process loop development.
4. Coordinate with customers for key issue analysis, aim to improve customer collaboration experience.
1. Si handling skill for front-end, back-end, and far back-end is required.
2. Cross-team communication and good coordination skills.
3. Process issue analysis and problem-solving skills are required.
4. Customer communication and engagement skills are required.
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To view the job application please visit tsmc.taleo.net.