IC Analog IC Layout 800x100

R&D Engineer

R&D Engineer
by Admin on 08-15-2023 at 2:31 pm

  • Full Time
  • Taiwan
  • Applications have closed

Website TSMC

Job Responsibilities

R&D Engineers conduct exploratory research in advanced CMOS, evaluate a variety of advanced materials, equipment/ tools, process/recipe tuning, and handle advanced device and process integration.

1. Research & Pathfinding 

(1) Define superior CMOS technology architecture and baseline.
(2) Identify Material, Transistor Struct ure, Tool, etc.

2. Integration 

(1) Define Technology Process Flow, including Device and SRAM.
(2) Enhance Yield and Reduce Defect
(3) Spice Modeling

3. Module 

(1) Develop Module Recipe
(2) Deliver Manufacturable Technology to meet quality and cost targets
(3) Ensure RD Line Stability and Cycle Time

4. RD Process Center

(1) Process Engineer (PE): Advanced module process development and baseline sustaining.
(2) Equipment Engineer (EE): Handle advanced equipment at R&D stage. Install, warm up, sustain, and troubleshoot the new technology equipment.
(3) Manufacturing (MFG): Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.

Job Qualifications

1. Master’s degree or above in an engineering and scientific field, such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
2. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.
3. Exhibit good and open communication skills, be able to work within cross-functional teams, including internal and external partners.
4. Fluent in English.
5. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
6. Flexibility in changing priorities and responsibilities to support business needs.
7. Hands-on participation and a strong sense of ownership.
8. Required to be on-site in the fab environment.

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