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Principal Wafer Level Packaging Engineer

Principal Wafer Level Packaging Engineer
by Admin on 01-16-2024 at 4:40 pm

Website Pragmatic

Overview

Pragmatic is seeking an experienced Packaging Development Engineer to join its expanding R&D team in Sedgefield. The Principal Wafer Level Packaging Engineer will be responsible for leading and coordinating wafer level packaging research and development activities for non-RFID applications, driving our internal roadmap and working closely with the Foundry, Operations and Process Engineering teams as well as external development partners.

Key tasks

  • Lead FlexIC’s wafer level packaging development activities.
  • Successfully develop and demonstrate FlexIC wafer packaging solutions
  • Develop assembly technologies for Flexible Hybrid Electronics (FHE) applications.
  • Day to day management, coordination and decision making related to packaging development activities

Qualifications and training

  • Degree or post-graduate in electronics, mechanical engineering, electronics engineering, MEMS or another relevant discipline; or equivalent experience.

Skills and experience

  • Experience with semiconductor packaging techniques including electroplating, redistribution layers, wafer bumping etc
  • Experience with semiconductor, MEMs and flexible electronics assembly techniques including direct die attach, flip chip, thermo bonding, solder, wire bonding etc
  • Experience with R2R and mechanical transfer processes (advantage)
  • Experience in leading development projects interacting with internal and external stakeholders
  • Knowledge and understanding of semiconductor fabrication techniques
  • Ability to work to tight deadlines and progress multiple projects simultaneously
  • Strong communication skills, interpersonal within the team and external facing
  • Ability to work independently and part of a team.
  • Project management experience
Apply for job

To view the job application please visit talent.pragmaticsemi.com.

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