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Jr. APE Engineer

Jr. APE Engineer
by Admin on 05-20-2024 at 2:07 pm

Website Alchip


1. Advanced Chiplet and 2.5d IC CoWoS packaging technology development.

2. Flip chip, Bumping, Fan-Out package technology development.

3. New product introduction development (NTO, DOE and corner plan, yield analysis, MP window)


1. +1 years of experience in Semiconductor Manufacturing specialized in advanced package engineering.

2. Good experience in 2.5d IC CoWoS, Fan-Out, Flip chip, Bumping wafer level packaging.

3. Good communication skills and fluency in both verbal and written English.

4. Experience working with diverse cultures.

Apply for job

To view the job application please visit www.104.com.tw.

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