Glass Core Technology – Plating Process Engineer

Essential Functions/Responsibilities:

• Research and implementation of new Final Finish processes.
• Monitor and improve throughput, quality, yield, and uptime of Final Finish Equipment/Process.
• Continuous improvement of existing Final Finish processes and analysis of reliability data.
• Establish analysis frequencies, chemistry bath life, and maintenance schedules and execute. statistical process control on a fully automated Final Finish tool.
• Update and maintain documentation of Final Finish Processes.
• Facilitate necessary experiments (DOE format) to troubleshoot quality issues.
• Deliver products which conform to IPC thickness specifications.

“The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities.”

Required Skills:

• 2+ years of hands-on-experience with electroless/electrolytic plating processes.
• In-depth understanding of plating chemistries, equipment, and processes.
• Experience in characterization of chemical components in plating processes.
• Excellent hands-on diagnostic, troubleshooting, analytical and problem-solving skills.
• Ability to analyze statistical data; familiarity with software such as JMP is preferred.
• Ability to shift focus among multiple priorities quickly.
• Be detail-oriented and able to work with minimal supervision.
• Be a highly-motivated, team-player with a positive attitude who is also excited about learning new skills and assisting with various projects and assignments as necessary.
• Working knowledge and understanding of, SDS, lock-out/tag-out, and OSHA requirements.
• Excellent communication and interpersonal skills for working with globally distributed researchers, engineers in our commercial organizations, and customers.

Desired Skills and Experience:

• Ability to apply fundamental theories in real engineering problem solving.
• Industry or R&D manufacturing experience with Electroless/Electrolytic Plating processes.
• Experience in semiconductor or glass wafer fabrication
• Experience with XRF and other plating metrology techniques.
• Experience in electroplating, wet etch, or other wet chemistry applications.
• Experience with analytical methods for plating chemistries.
• Familiarity with IPC specification documents e.g. IPC 4552
• 5+ years of experience in plating and wet chemistry applications.
• 5+ years of production operations experience, particularly in high volume manufacturing.

Education:

• Bachelors or Masters in Chemistry or Chemical Engineering is preferred.
• Extensive job experience or other technical / engineering education can be substituted for educational preferences