Fall 2020 Intern, Software Development (Electronics Thermal Analysis) – Bachelors or Masters

Ansys is the global leader in engineering simulation, helping the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, Ansys helps companies solve the most complex design challenges and engineer products limited only by imagination.

ANSYS empowers the world’s most innovative companies to design and deliver transformational products by offering the best and broadest engineering simulation software to solve the most complex design challenges and engineer products limited only by imagination. Thus, through our enriching internship program, we help develop the next-generation of engineers and technologists.

As a student intern/co-op, you will help develop our industry-leading simulation software while gaining real experience in your field of study.  You will work on a variety of impactful projects to help maintain, advance, and accelerate ANSYS products.

In this internship, you will support our Electronics Business Unit. This is a 40-hour per week paid position starting August 2020 and concluding December 2020.

RESPONSIBILITIES
− Work alongside software developers during the design, implementation and verification process of the Icepak product.
− Develop prototypes or test new toolkits.
− Investigate defects in production code.
− Develop unit and regression tests.
− Analyze results and communicate findings using visualization software.

MINIMUM QUALIFICATIONS
− Pursuing a Bachelor’s or Master’s in Computer Science, Engineering, or related technical degree with a GPA of 3.0 or higher.
− Currently enrolled in a full-time degree program and returning to university after the completion of the internship program.
− Experience in scripting, especially Python.

PREFERRED QUALIFICATIONS
− Experience with software development is a plus.