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CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis
CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis
A “PCB thermal analysis” design activity has traditionally involved the PCB designer transferring a finished design to a dedicated thermal analysis tool. While this has indeed successfully contributed to numerous PCB thermal signoffs in the past, there are inefficiencies that can be mitigated with the use of Cadence’s Allegro X Design Platform for PCBs and …
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