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Webinar: Power Integrity Challenges and Solutions for Interposer Design
Webinar: Power Integrity Challenges and Solutions for Interposer Design
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation. …
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