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Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities
Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities
Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …